Thermal & Flow coupled analysis of Heat Sink

A heat sink is an electronic device that incorporates either a fan or a peltier device to keep a hot component such as a processor cool. The fins are provided to increase the suface area for heat transfer. The air stream pass through the fin gaps and by this process remove the heat. In this conjugate heat transfer analysis a flared fin heat sink design is considered with a laminar air flow around the fins. a heat source of 1 W and resistive thin layer of 0.5 mm is provided at bottom portion. In the above CAE image the arrow line indicates the air flow direction, velocity magnitudes respectively. Large arrows represents the high velocity and smaller for lower velocity magnitude. The high temperature values are plotted with red colour while low temperature with yellow.