Coupled thermal analysis aerofoil type heat sink design

A heat sink is an electronic device that incorporates either a fan or a peltier device to keep a hot component such as a processor cool. The fins are provided to increase the surface area for heat transfer. The air stream pass through the fin gaps and by this process remove the heat. In this conjugate heat transfer analysis a airfoil fin type heat sink design is considered with a laminar air flow around the fins. A heat source of 1 W and resistive thin layer of 0.5 mm is provided at bottom portion. In the above cae image the sliced plains shows the air flow magnitude; high in red and low in blue colour. The minimal temperature on fin surfaces is plotted with blue colour and maximum with green colour.