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Multiphysics approach for cooling performance prediction of flared fin heat sink design
A heat sink is an electronic device that incorporates either a fan or a peltier device to keep a hot component such as a processor cool. The fins are provided to increase the suface area for heat transfer. The air stream pass through the fin gaps and by this process remove the heat. In this conjugate heat transfer analysis a flared fin heat sink design is considered with a laminar air flow around the fins. a heat source of 1 W and resistive thin layer of 0.5 mm is provided at bottom portion. The above CAE image the stream lines represents the vorticity field around the heat sink design.
